Xiaomi Combine Flip is anticipated to launch alongside the Combine Fold 4, turning into the corporate’s first clamshell foldable smartphone. The Chinese language telephone manufacturing firm not too long ago launched the Combine Fold 3, however is but to formally announce a Flip mannequin. Now, the Xiaomi Combine Flip has reportedly been noticed on the IMEI database hinting at its imminent launch. Design renders of the purported Xiaomi clamshell foldable telephone have been additionally beforehand leaked. The telephone is anticipated to be a notable competitor to the not too long ago launched Samsung Galaxy Z Flip 5.
An ITHome report noticed the Xiaomi Combine Flip on the IMEI database with the mannequin quantity 2311BPN23C. Within the screengrab shared on the Korean tech information web site, the Combine Flip moniker appears to have been confirmed, which was additionally tipped beforehand.
The Xiaomi Combine Flip is alleged to be very skinny and light-weight, in comparison with different up to date clamshell fashions. Notably, the Combine Fold 3 is tipped to be slimmer than Samsung’s Galaxy Z Fold 5.
An earlier GSMChina report instructed the attainable design renders of the Xiaomi Combine Flip, that the publication claimed to have drawn up based mostly on sure manufacturing facility leaks. The purported handset is alleged to characteristic a triple rear digicam unit, with the third digicam providing 3x zooming capacities. A entrance digicam is seen with a centre-aligned hole-punch slot on the prime of the first show.
Like most flagship telephones anticipated to launch in 2024, the Xiaomi Combine Flip is alleged to be powered by a yet-unannounced Qualcomm Snapdragon 8 Gen 3 SoC. It’s anticipated to be a powerful competitor to the Galaxy Z Flip 5, which is powered by a Qualcomm Snapdragon 8 Gen 2 SoC and is supplied with two 12-megapixel rear digicam sensors and a 10-megapixel entrance digicam sensor.
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